LFBK20104M241-T [TAIYO YUDEN]
Ferrite Chip, 1 Function(s), 0.1A, ROHS COMPLIANT PACKAGE-8;
| 型号： | LFBK20104M241-T |
| 厂家： | 
TAIYO YUDEN (U.S.A.), INC |
| 描述： | Ferrite Chip, 1 Function(s), 0.1A, ROHS COMPLIANT PACKAGE-8 |
| 文件： | 总31页 (文件大小：890K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Notice for TAIYO YUDEN productsꢀ
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2012. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-
rating such products, which are caused under the conditions other than those specified in this catalog or individual
specification.
■ Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is
available.
■ Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
■ All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called“TAIYO YUDEN’s official sales channel”).
It is only applicable to the products purchased from any of TAIYO YUDEN’s official sales channel.
■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-
cur in connection with a third party's intellectual property rights and other related rights arising from your usage of
products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to“Foreign Exchange and For-
eign Trade Control Law”of Japan,“U.S. Export Administration Regulations”, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
MULTILAYER CHIP BEAD INDUCTORS (BK ARRAY SERIES)
REFLOW
■PARTS NUMBER
△＝Blank space
B
K △
①
3
2
1
6
4
S
6
0
1
－ T
⑤
△
⑥
②
③
④
①Series name
Code
④Nominal impedance
Series name
Multilayer chip bead Inductor
Code
（example）
601
Nominal impedance［Ω］
BK△
600
②Dimensions（L×W）
Code
102
1000
Dimensions
Type（inch）
（L×W）［mm］
2.0×1.0
⑤Packaging
Code
2010
3216
2010（0804）
3216（1206）
Packaging
Taping
3.2×1.6
－T
③Material
Code
4W
⑥Internal code
Material
Code
△
Internal code
Standard
4S
Refer to impedance curves
for material differences
4M
4L
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
／
Standard quantity [pcs]
Embossed
tape
Type
L
W
T
E1
E2
P
Paper tape
BK 2010
（0804）
BK 3216
（1206）
2.0±0.15
（0.079±0.006）
3.2±0.2
1.0±0.15
（0.039±0.00）
1.6±0.2
0.45±0.05
0.25＋0.15/－0.1
0.25±0.15
0.5±0.1
4000
－
（0.018±0.002） （0.010＋0.006/－0.004） （0.010±0.006） （0.020±0.004）
0.8±0.1
0.35±0.2
0.3±0.2
0.8±0.1
－
4000
（0.126±0.008） （0.063±0.008） （0.031±0.004）
（0.014±0.008）
（0.012±0.008） （0.031±0.004）
Unit：mm（inch）
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
96
■PARTS NUMBER
●BK 2010
Nominal impedance
［Ω］
Measuring frequency
［MHz］
DC Resistance
［Ω］（max.）
Rated current
［mA］（max.）
Parts number
EHS
Impedance tolerance
BK 20104W680-T
BK 20104W121-T
BK 20104W241-T
BK 20104S121-T
BK 20104S241-T
BK 20104S431-T
BK 20104S601-T
BK 20104M121-T
BK 20104M241-T
BK 20104M431-T
BK 20104M601-T
BK 20104M102-T
BK 20104L050-T
BK 20104L100-T
BK 20104L220-T
BK 20104L330-T
BK 20104L470-T
BK 20104L680-T
BK 20104L121-T
BK 20104L181-T
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
68
120
240
120
240
430
600
120
240
430
600
1000
5
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
0.35
0.40
0.50
0.30
0.45
0.55
0.70
0.30
0.45
0.55
0.70
0.80
0.10
0.15
0.20
0.30
0.40
0.50
0.70
0.90
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
10
22
33
47
68
120
180
●BK 3216
Nominal impedance
［Ω］
Measuring frequency
［MHz］
DC Resistance
［Ω］（max.）
Rated current
［mA］（max.）
Parts number
EHS
Impedance tolerance
BK 32164W121-T
BK 32164W241-T
BK 32164W431-T
BK 32164W601-T
BK 32164S600-T
BK 32164S121-T
BK 32164S241-T
BK 32164S301-T
BK 32164S471-T
BK 32164S601-T
BK 32164S102-T
BK 32164M121-T
BK 32164M241-T
BK 32164M301-T
BK 32164M471-T
BK 32164M601-T
BK 32164M102-T
BK 32164L680-T
BK 32164L121-T
BK 32164L181-T
BK 32164L241-T
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
120
240
430
600
60
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
0.15
0.25
0.35
0.40
0.18
0.18
0.30
0.40
0.40
0.45
0.68
0.20
0.35
0.45
0.50
0.60
0.80
0.35
0.55
0.65
0.75
100
100
100
100
200
200
200
200
200
200
100
150
150
150
150
100
100
200
200
150
150
120
240
300
470
600
1000
120
240
300
470
600
1000
68
／
120
180
240
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
97
■ ELECTRICAL CHARACTERISTICS
BK2010
■
BK2010 4W680
BK2010 4W121
BK2010 4S431
BK2010 4M431
BK2010 4W241
BK2010 4S601
BK2010 4M601
BK2010 4S121
BK2010 4M121
BK2010 4M102
500
250
500
400
300
200
100
BK2010 4S241
500
400
300
200
1000
800
600
400
1000
800
600
400
500
250
100
200
200
BK2010 4M241
2000
1000
2000
1000
／
BK2010 4L050
BK2010 4L100
BK2010 4L220
BK2010 4L330
100
100
200
100
500
250
50
50
1
10
100
1000
10000
1
10
100
1000
10000
1
10
100
1000
10000
1
10
100
1000
10000
BK2010 4L470
500
250
1
10
100
1000
10000
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
98
■ ELECTRICAL CHARACTERISTICS
BK3216
■
／
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
99
Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
Multilayer common mode choke coils（MC series F type）
■PACKAGING
①Minimum Quantity
●Tape & Reel Packaging
Standard Quantity ［pcs］
Thickness
mm（inch）
Type
CK1608（0603）
CK2125（0805）
Paper Tape
Embossed Tape
－
0.8 （0.031）
0.85（0.033）
1.25（0.049）
0.85（0.033）
1.25（0.049）
0.8 （0.031）
0.9 （0.035）
0.9 （0.035）
0.7 （0.028）
0.9 （0.035）
1.1 （0.043）
0.9 （0.035）
1.1 （0.043）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
1.25（0.049）
0.2 （0.008）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
1.0 （0.039）
0.2 （0.008）
0.3 （0.012）
0.3 （0.012）
0.3 （0.012）
0.5 （0.020）
0.2 （0.008）
0.3 （0.012）
0.5 （0.020）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
1.25（0.049）
0.45（0.018）
0.8 （0.031）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
0.4 （0.016）
0.55（0.022）
0.45（0.018）
4000
4000
－
－
2000
－
4000
－
CKS2125（0805）
2000
－
CKP1608（0603）
CKP2012（0805）
CKP2016（0806）
4000
－
3000
3000
3000
3000
2000
3000
2000
－
－
－
CKP2520（1008）
－
－
NM2012（0805）
NM2520（1008）
LK1005（0402）
LK1608（0603）
－
－
10000
4000
4000
－
－
－
LK2125（0805）
2000
－
HK0402（01005）
HK0603（0201）
HK1005（0402）
HK1608（0603）
20000
15000
10000
4000
－
－
－
－
4000
3000
40000
－
HK2125（0805）
－
HKQ0402（01005）
HKQ0603W（0201）
HKQ0603S（0201）
HKQ0603U（0201）
AQ105（0402）
20000
15000
15000
15000
10000
20000
15000
10000
10000
4000
4000
－
－
－
－
BK0402（01005）
BK0603（0201）
BK1005（0402）
BKH1005（0402）
BK1608（0603）
－
－
－
－
－
－
BK2125（0805）
2000
－
BK2010（0804）
BK3216（1206）
BKP0603（0201）
BKP1005（0402）
BKP1608（0603）
BKP2125（0805）
MCF0806(0302)
MCF1210(0504)
MCF2010(0804)
4000
－
4000
－
15000
10000
4000
4000
－
－
－
－
10000
5000
4000
－
－
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-01
②Taping material
●Card board carrier tape
CK
1608
1608
2125
2125
1005
1608
2125
0402
0603
1005
1608
0402
0603
105
BK
0402
0603
1005
1608
2125
2010
0603
1005
1608
2125
1005
BK
CKP
CK
BK
BK
CKS
LK
BK
BK
LK
BKP
BKP
BKP
BKP
BKH
LK
HK
HK
HK
HK
HKQ
HKQ
AQ
●Embossed Tape
CK
2125
2125
2012
2016
2520
2012
2520
2125
0402
2125
BK
2125
3216
0806
1210
2010
CKS
CKP
CKP
CKP
NM
BK
MCF
MCF
MCF
NM
LK
HKQ
HK
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-01
③Taping Dimensions
●Paper tape (0.315 inches wide)
Unit : mm（inch）
Chip cavity
Insertion Pitch
Ｆ
Tape Thickness
Ｔ
Thickness
mm（inch）
Type
Ａ
Ｂ
1.0±0.2
1.8±0.2
4.0±0.1
1.1max
CK1608（0603）
CK2125（0805）
CKS2125（0805）
CKP1608（0603）
LK1005（0402）
LK1608（0603）
LK2125（0805）
HK0402（01005）
HK0603（0201）
HK1005（0402）
HK1608（0603）
HKQ0402（01005）
HKQ0603W（0201）
HKQ0603S（0201）
HKQ0603U（0201）
AQ105（0402）
0.8 （0.031）
0.85（0.033）
0.85（0.033）
0.8 （0.031）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
0.2 （0.008）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.2 （0.008）
0.3 （0.012）
0.3 （0.012）
0.3 （0.012）
0.5 （0.020）
0.2 （0.008）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
0.45（0.018）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
0.5 （0.020）
（0.039±0.008）
1.5±0.2
（0.071±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.043max）
1.1max
（0.059±0.008）
1.5±0.2
（0.091±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.043max）
1.1max
（0.059±0.008）
1.0±0.2
（0.091±0.008）
1.8±0.2
（0.157±0.004）
4.0±0.1
（0.043max）
1.1max
（0.039±0.008）
0.65±0.1
（0.071±0.008）
1.15±0.1
（0.157±0.004）
2.0±0.05
（0.043max）
0.8max
（0.026±0.004）
1.0±0.2
（0.045±0.004）
1.8±0.2
（0.079±0.002）
4.0±0.1
（0.031max）
1.1max
（0.039±0.008）
1.5±0.2
（0.071±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.043max）
1.1max
（0.059±0.008）
0.25±0.04
（0.091±0.008）
0.45±0.04
（0.157±0.004）
2.0±0.05
（0.043max）
0.36max
（0.010±0.002）
0.40±0.06
（0.018±0.002）
0.70±0.06
（0.079±0.002）
2.0±0.05
（0.014max）
0.45max
（0.016±0.002）
0.65±0.1
（0.028±0.002）
1.15±0.1
（0.079±0.002）
2.0±0.05
（0.018max）
0.8max
（0.026±0.004）
1.0±0.2
（0.045±0.004）
1.8±0.2
（0.079±0.002）
4.0±0.1
（0.031max）
1.1max
（0.039±0.008）
0.25±0.04
（0.071±0.008）
0.45±0.04
（0.157±0.004）
2.0±0.05
（0.043max）
0.36max
（0.010±0.002）
0.40±0.06
（0.018±0.002）
0.70±0.06
（0.079±0.002）
2.0±0.05
（0.01max）
0.45max
（0.016±0.002）
0.40±0.06
（0.028±0.002）
0.70±0.06
（0.079±0.002）
2.0±0.05
（0.018max）
0.45max
（0.016±0.002）
0.40±0.06
（0.028±0.002）
0.70±0.06
（0.079±0.002）
2.0±0.05
（0.018max）
0.45max
（0.016±0.002）
0.75±0.1
（0.028±0.002）
1.15±0.1
（0.079±0.002）
2.0±0.05
（0.018mx）
0.8max
（0.030±0.004）
0.25±0.04
（0.045±0.004）
0.45±0.04
（0.079±0.002）
2.0±0.05
（0.031max）
0.36max
BK0402（01005）
BK0603（0201）
BK1005（0402）
BK1608（0603）
BK2125（0805）
BK2010（0804）
BKP0603（0201）
BKP1005（0402）
BKP1608（0603）
BKP2125（0805）
BKH1005（0805）
（0.010±0.002）
0.40±0.06
（0.018±0.002）
0.70±0.06
（0.079±0.002）
2.0±0.05
（0.014max）
0.45max
（0.016±0.002）
0.65±0.1
（0.028±0.002）
1.15±0.1
（0.079±0.002）
2.0±0.05
（0.018max）
0.8max
（0.026±0.004）
1.0±0.2
（0.045±0.004）
1.8±0.2
（0.079±0.002）
4.0±0.1
（0.031max）
1.1max
（0.039±0.008）
1.5±0.2
（0.071±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.043max）
1.1max
（0.059±0.008）
1.2±0.1
（0.091±0.008）
2.17±0.1
（0.157±0.004）
4.0±0.1
（0.043max）
0.8max
（0.047±0.004）
0.40±0.06
（0.085±0.004）
0.70±0.06
（0.157±0.004）
2.0±0.05
（0.031max）
0.45max
（0.016±0.002）
0.65±0.1
（0.028±0.002）
1.15±0.1
（0.079±0.002）
2.0±0.05
（0.018max）
0.8max
（0.026±0.004）
1.0±0.2
（0.045±0.004）
1.8±0.2
（0.079±0.002）
4.0±0.1
（0.031max）
1.1max
（0.039±0.008）
1.5±0.2
（0.071±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.043max）
1.1max
（0.059±0.008）
0.65±0.1
（0.091±0.008）
1.15±0.1
（0.157±0.004）
2.0±0.05
（0.043max）
0.8max
（0.026±0.004）
（0.045±0.004）
（0.079±0.002）
（0.031max）
Unit : mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-01
●Embossed Tape (0.315 inches wide)
Chip cavity
Insertion Pitch
Ｆ
Tape Thickness
Thickness
Type
mm（inch）
Ａ
Ｂ
K
T
1.5±0.2
2.3±0.2
4.0±0.1
2.0
（0.079）
2.0
0.3
CK2125（0805）
CKS2125（0805）
CKP2012（0805）
CKP2016（0806）
1.25（0.049）
（0.059±0.008）
1.5±0.2
（0.091±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.012）
0.3
1.25（0.049）
0.9 （0.035）
0.9 （0.035）
0.7 （0.028）
0.9 （0.035）
1.1 （0.043）
0.9 （0.035）
1.1 （0.043）
1.25（0.049）
0.85（0.033）
1.0 （0.039）
1.25（0.049）
0.8（0.031）
（0.059±0.008）
1.55±0.2
（0.091±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.079）
1.3
（0.012）
0.3
（0.061±0.008）
1.8±0.1
（0.091±0.008）
2.2±0.1
（0.157±0.004）
4.0±0.1
（0.051）
1.3
（0.012）
0.25
（0.071±0.004）
（0.087±0.004）
（0.157±0.004）
（0.051）
1.4
（0.01）
（0.055）
1.4
2.3±0.1
2.8±0.1
4.0±0.1
0.3
CKP2520（1008）
（0.091±0.004）
（0.110±0.004）
（0.157±0.004）
（0.055）
1.7
（0.012）
（0.067）
1.3
1.55±0.2
（0.061±0.008）
2.3±0.1
2.3±0.2
（0.091±0.008）
2.8±0.1
4.0±0.1
（0.157±0.004）
4.0±0.1
0.3
（0.012）
0.3
NM2012（0805）
NM2520（1008）
LK2125（0805）
（0.051）
1.7
（0.091±0.004）
1.5±0.2
（0.110±0.004）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.067）
2.0
（0.012）
0.3
（0.059±0.008）
（0.091±0.008）
（0.157±0.004）
（0.079）
1.5
（0.012）
（0.059）
2.0
1.5±0.2
2.3±0.2
4.0±0.1
0.3
HK2125（0805）
（0.059±0.008）
（0.091±0.008）
（0.157±0.004）
（0.012）
（0.079）
2.0
1.5±0.2
（0.059±0.008）
1.9±0.1
2.3±0.2
（0.091±0.008）
3.5±0.1
4.0±0.1
（0.157±0.004）
4.0±0.1
0.3
（0.012）
0.3
BK2125（0805）
BK3216（1206）
MCF0806(0302)
MCF1210(0504)
MCF2010(0804)
（0.079）
1.4
（0.075±0.004）
0.75±0.05
（0.138±0.004）
0.95±0.05
（0.157±0.004）
2.0±0.05
（0.055）
0.55
（0.012）
0.3
0.4 （0.016）
0.55（0.022）
0.45（0.018）
（0.030±0.002）
1.15±0.05
（0.037±0.002）
1.40±0.05
（0.079±0.002）
4.0±0.1
（0.022）
0.65
（0.012）
0.3
（0.045±0.002）
1.1±0.1
（0.055±0.002）
2.3±0.1
（0.157±0.004）
4.0±0.1
（0.026）
0.85
（0.012）
0.3
（0.043±0.004）
（0.091±0.004）
（0.157±0.004）
（0.033）
（0.012）
Unit : mm（inch）
●Embossed Tape (0.157 inches wide)
Chip cavity
Insertion Pitch
Tape Thickness
Thickness
Type
mm（inch）
Ａ
Ｂ
Ｆ
K
T
HKQ0402(01005)
0.2 （0.008）
0.23
0.43
1.0±0.02
0.5max.
0.25max.
Unit : mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-01
④LEADER AND BLANK PORTION
⑤Reel Size
Less than 1.5mm
5±1.0mm
(0.197±0.039)
⑥Top tape strength
The top tape requires a peel-off force of 0.1～0.7N in the direction of the arrow as illustrated below.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-01
Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
Multilayer common mode choke coils（MC series F type）
■RELIABILITY DATA
1. Operating Temperature Range
BK0402
BK0603
BK1005
BKH1005
－55～＋125℃
BK1608
BK2125
BK2010
ARRAY
BK3216
BKP0603
BKP1005
－55～＋85℃
BKP1608
BKP2125
MCF 0806
MCF 1210
MCF 2010
CK1608
－40～＋85℃
－40～＋85℃
－55～＋125℃
CK2125
Specified Value
CKS2125
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0402/HKQ0402
HK0603
HK1005
HK1608
－40～＋85℃
－55～＋125℃
HK2125
HKQ0603W/HKQ0603S/HKQ0603U
AQ105
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-01
2. Storage Temperature Range
BK0402
BK0603
BK1005
BKH1005
BK1608
BK2125
－55～＋125℃
BK2010
BK3216
ARRAY
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806
MCF 1210
MCF 2010
CK1608
－55～＋85℃
－40～＋85℃
CK2125
Specified Value
CKS2125
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
－40～＋85℃
LK1608
LK2125
HK0402/HKQ0402
HK0603
HK1005
HK1608
HK2125
－55～＋125℃
－40～＋85℃
－55～＋125℃
HKQ0603W/HKQ0603S/HKQ0603U
AQ105
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-01
3. Rated Current
BK0402
BK0603
BK1005
BKH1005
BK1608
BK2125
240～540mA DC
100～500mA DC
120～1000mA DC
200mA DC
150～1500mA DC
200～1200mA DC
100mA DC
BK2010
BK3216
ARRAY
100～200mA DC
1.0A DC
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806
MCF 1210
MCF 2010
CK1608
800～2000mA DC
1.0～3.0A DC
1.5～4.0A DC
0.1～0.13A DC
0.1A DC
0.1A DC
50～60mA DC
60～500mA DC
110～280mA DC
0.35～0.9A DC
0.7～1.2A DC
0.9～1.6A DC
1.1～1.8A DC
0.8～1.5A DC
0.9～1.1A DC
20～25mA DC
1～150mA DC
5～300mA DC
160～380mA DC
60～470mA DC
110～300mA DC
150～300mA DC
300mA DC
CK2125
CKS2125
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
Specified Value
LK1608
LK2125
HK0402
HK0603
HK1005
HK1608
HK2125
HKQ0402
HKQ0603W
HKQ0603S
HKQ0603U
AQ105
90～500mA DC
160～850mA DC
130～600mA DC
130～600mA DC
280～710mA DC
Definition of rated current：
・In the CK, CKS and BK Series, the rated current is the value of current at which the temperature of the element is increased within 20℃.
・In the BK Series P type and CK Series P type, NM Series the rated current is the value of current at which the temperature of the element is increased within
40℃.
・In the LK, HK, HKQ, and AQ Series, the rated current is either the DC value at which the internal L value is decreased within 5% with the application of DC bias,
or the value of current at which the temperature of the element is increased within 20℃.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-01
4. Impedance
BK0402
BK0603
BK1005
BKH1005
BK1608
BK2125
10～120Ω ±25%
10～600Ω ±25%
10～1800Ω ±25%
1500～1800Ω ±25%
22～2500Ω ±25%
15～2500Ω ±25%
5～1000Ω ±25%
68～1000Ω ±25%
22～33Ω ±25%
BK2010
BK3216
ARRAY
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806
MCF 1210
MCF 2010
CK1608
10～220Ω ±25%
33～470Ω ±25%
33～330Ω ±25%
12～90Ω ±5Ω(12Ω), ±20%(Other)
90Ω ±25%
90Ω ±25%
CK2125
Specified Value
CKS2125
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
－
LK1608
LK2125
HK0402/HKQ0402
HK0603
HK1005
HK1608
HK2125
HKQ0603W/HKQ0603S/HKQ0603U
AQ105
BK0402Series
Measuring frequency
Measuring equipment
Measuring jig
: 100±1MHz
: E4991A（or its equivalent）
: 16196D（or its equivalent）
BK0603Series, BKP0603Series
Measuring frequency
Measuring equipment
Measuring jig
: 10±1MHz
: 4291A（or its equivalent）
: 16193A（or its equivalent）
BK1005Series, BKP1005Series ,BKH1005Series
Test Methods and
Remarks
Measuring frequency
Measuring equipment
Measuring jig
: 100±1MHz
: 4291A（or its equivalent）
: 16192A（or its equivalent）, 16193A（or its equivalent）
BK1608・2125Series, BKP1608・2125Series
Measuring frequency
Measuring equipment
Measuring jig
: 100±1MHz
: 4291A（or its equivalent）, 4195A（or its equivalent）
: 16092A（or its equivalent） or 16192A（or its equivalent）/HW
BK2010・3216Series,MCFSeries
Measuring frequency
Measuring equipment
Measuring jig
: 100±1MHz
: 4291A（or its equivalent）, 4195A（or its equivalent）
: 16192A（or its equivalent）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-01
5. Inductance
BK0402
BK0603
BK1005
BKH1005
BK1608
BK2125
BK2010
BK3216
ARRAY
－
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806
MCF 1210
MCF 2010
CK1608
4.7～10.0μH： ±20%
0.1～10.0μH： ±20%
1.0～10.0μH： ±20%
0.33～2.2μH： ±20%
0.47～4.7μH： ±20%
0.47～4.7μH： ±20%
0.47～4.7μH： ±20%
0.82～1.0μH： ±20%
1.0～2.2μH： ±20%
CK2125
CKS2125
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
Specified Value
NM2520
LK1005
Inductance 0.12～2.2μH： ±10%, Q 0.12～2.2μH： ±30%
Inductance 0.047～33.0μH： ±20% 0.10～12.0μH： ±10%
Q 0.12～2.2μH： ±30%
LK1608
LK2125
Inductance 0.047～33.0μH： ±20% 0.10～12.0μH： ±10%
Q 0.12～2.2μH： ±30%
HK0402
HK0603
HK1005
HK1608
HK2125
HKQ0402
HKQ0603W
1.0～6.2nH： ±0.3nH 6.8～12nH： ±5%
1.0～6.2nH： ±0.3nH 6.8～100nH： ±5%
1.0～6.2nH： ±0.3nH 6.8～270nH： ±5%
1.0～5.6nH： ±0.3nH 6.8～470nH： ±5%
1.5～5.6nH： ±0.3nH 6.8～470nH： ±5%
0.5～5.6nH： ±0.3nH 6.2～27nH： ±5%
0.6～3.9nH： ±0.3nH 4.3～22nH： ±5%
HKQ0603S
0.6～6.2nH： ±0.3nH 6.8～22nH： ±5%
HKQ0603U
AQ105
0.6～6.2nH： ±0.3nH 6.8～22nH： ±5%
1.0～6.2nH： ±0.3nH 6.8～15nH： ±5%
CKSeries
Measuring frequency
Measuring frequency
Measuring frequency
LKSeries
: 2～4MHz（CK1608）
: 2～25MHz（CK2125）
: 2～1MHz（CKS2125）
Measuring frequency
Measuring frequency
Measuring frequency
CKP、NMSeries
: 10～25MHz（LK1005）
: 1～50MHz（LK1608）
: 0.4～50MHz（LK2125）
Measuring frequency
Measuring equipment /jig
: 1MHz（CKP2012・CKP2016・CKP2520・NM2012・NM2520）
:・4194A＋16085B＋16092A（or its equivalent）
・4195A＋41951＋16092A（or its equivalent）
・4294A＋16192A（or its equivalent）
Test Methods and
Remarks
・4291＋1693A（or its equivalent）/LK1005
・4285A＋42841A＋42842C＋42851－61100（CKP2012・CKP2016・CKP2520・NM2012・NM2520）
:・1mA rms（0.047～4.7μH）
Measuring current
・0.1mA rms（5.6～33μH）
HK、HKQ、AQ Series
Measuring frequency
Measuring frequency
Measuring frequency
Measuring frequency
Measuring equipment /jig
: 100MHz（HK0402・HKQ0402・HK0603・HK1005・AQ105）
: 50/100MHz（HK1608・HK2125）
: 500MHz（HKQ0402・HKQ0603S・HKQ0603U）
: 300/500MHz（HKQ0603W）
:・4291A＋16197A（or its equivalent）/HK060・AQ105
・4291A＋16193A（or its equivalent）/HK1005
・E4991A＋16197A（or its equivalent）/HKQ0603S・HKQ0603・HKQ0603W
・4291A＋16092A ＋ in-house made jig（or its equivalent）/HK1608・HK2125
・E4991A＋16196D（or its equivalent）/HK0402・HKQ0402
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-01
6. Q
BK0402
BK0603
BK1005
BKH1005
BK1608
BK2125
BK2010
BK3216
ARRAY
－
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806
MCF 1210
MCF 2010
CK1608
20 min.
CK2125
15～20 min.
CKS2125
Specified Value
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
－
10～20 min.
10～35 min.
15～50 min.
3 min.
LK1608
LK2125
HK0402
HK0603
4～5 min.
8 min.
HK1005
HK1608
8～12 min.
10～18 min.
3～8 min.
14～15 min.
10～13 min.
10～13 min.
8 min.
HK2125
HKQ0402
HKQ0603W
HKQ0603S
HKQ0603U
AQ105
CKSeries
Measuring frequency
Measuring frequency
LKSeries
: 2～4MHz（CK1608）
: 2～25MHz（CK2125）
Measuring frequency
Measuring frequency
Measuring frequency
: 10～25MHz（LK1005）
: 1～50MHz（LK1608）
: 0.4～50MHz（LK2125）
Measuring equipment /jig :・4194A＋16085B＋16092A（or its equivalent）
・4195A＋41951＋16092A（or its equivalent）
・4294A＋16192A（or its equivalent）
・4291A＋16193A（or its equivalent）/LK1005
Test Methods and
Remarks
Measuring current
・1mA rms（0.047～4.7μH）
・0.1mA rms（5.6～33μH）
HK、HKQ、AQ Series
Measuring frequency
Measuring frequency
Measuring frequency
Measuring frequency
: 100MHz（HK0402・HKQ0402・HK0603・HK1005・AQ105）
: 50/100MHz（HK1608・HK2125）
: 500MHz（HKQ0402・HKQ0603S・HKQ0603U）
: 300/500MHz（HKQ0603W）
Measuring equipment /jig :・4291A＋16197A（or its equivalent）/HK0603・AQ105
・4291A＋16193A（or its equivalent）/HK1005
・E499A＋16197A（or its equivalent）/HKQ0603S・HKQ0603U・HKQ0603W
・4291A＋16092A ＋ in-house made jig（or its equivalent）/HK1608, HK2125
・E4991A＋16196D（or its equivalent）HK0402・HKQ0402
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-01
7. DC Resistance
BK0402
BK0603
BK1005
BKH1005
BK1608
BK2125
0.10～0.53Ω max.
0.065～1.50Ω max.
0.03～0.80Ω max.
1.50～2.00Ω max.
0.05～1.10Ω max.
0.05～0.75Ω max.
0.10～0.90Ω max.
0.15～0.80Ω max.
0.065～0.070Ω max.
0.030～0.20Ω max.
0.025～0.18Ω max.
0.020～0.075Ω max.
2.5～6.5Ω max.
BK2010
BK3216
ARRAY
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806
MCF 1210
MCF 2010
CK1608
4.5Ω max.
4.5Ω max.
0.45～0.85Ω（±30%）
0.16～0.65Ω max.
0.09～0.40Ω typ.
0.12～0.52Ω max.
0.15～0.35Ω max.
0.10～0.28Ω max.
0.08～0.20Ω max.
0.05～0.16Ω max.
0.10～0.19Ω max.
0.13～0.22Ω max.
0.41～1.16Ω max.
0.2～2.2Ω max.
CK2125
CKS2125
Specified Value
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
0.1～1.1Ω max.
HK0402
HK0603
HK1005
HK1608
HK2125
HKQ0402
HKQ0603W
0.18～0.99Ω max.
0.11～3.74Ω max.
0.08～4.8Ω max.
0.05～2.6Ω max.
0.10～1.5Ω max.
0.08～2.24Ω max.
0.07～1.6Ω max.
HKQ0603S
0.06～1.29Ω max.
HKQ0603U
AQ105
0.06～1.29Ω max.
0.07～0.45Ω max.
Test Methods and
Remarks
Measuring equipment：VOAC-7412（made by Iwasaki Tsushinki） VOAC-7512（made by Iwasaki Tsushinki）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-01
8. Self Resonance Frequency（SRF）
BK0402
BK0603
BK1005
BKH1005
BK1608
BK2125
BK2010
BK3216
ARRAY
－
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806
MCF 1210
MCF 2010
CK1608
17～25MHz min.
24～235MHz min.
CK2125
CKS2125
Specified Value
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0402
HK0603
HK1005
HK1608
HK2125
－
40～180MHz min.
9～260MHz min.
13～320MHz min.
29000～10000MHz min.
900～10000MHz min.
400～10000MHz min.
300～10000MHz min.
200～4000MHz min.
HKQ0402
1700～10000MHz min.
HKQ0603W
HKQ0603S
HKQ0603U
AQ105
2500～10000MHz min.
1900～10000MHz min.
1900～10000MHz min.
2300～10000MHz min.
LKSeries :
Measuring equipment
Measuring jig
: 4195A（or its equivalent）
Test Methods and
Remarks
: 41951＋16092A（or its equivalent）
HK、HKQ、AQSeries :
Measuring equipment
: 8719C（or its equivalent）・8753D（or its equivalent）/HK2125
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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9. Temperature Characteristic
BK0402
BK0603
BK1005
BKH1005
BK1608
BK2125
BK2010
BK3216
ARRAY
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806
MCF 1210
MCF 2010
CK1608
－
CK2125
CKS2125
CKP1608
Specified Value
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0402
HK0603
HK1005
HK1608
HK2125
HKQ0402
HKQ0603W
Inductance change：Within ±10％
HKQ0603S
HKQ0603U
AQ105
HK、HKQ、AQSeries：
Temperature range
Reference temperature
Test Methods and
Remarks
: －30～＋85℃
: ＋20℃
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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10. Resistance to Flexure of Substrate
BK0402
BK0603
BK1005
BKH1005
BK1608
BK2125
BK2010
BK3216
ARRAY
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806
MCF 1210
MCF 2010
CK1608
CK2125
CKS2125
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
Specified Value
No mechanical damage.
LK1608
LK2125
HK0402
HK0603
HK1005
HK1608
HK2125
HKQ0402
HKQ0603W
HKQ0603S
HKQ0603U
AQ105
Warp
: 2mm（BK Series without 0402size,、BKP、BKH、CK、CKS、CKP、NM、LK、HK、HKQ0603S、HKQ0603U、AQ Series、
MCF1210）
: 1mm（BK0402、HK0402、HKQ0402、HKQ0603W Series、MCF Series without 1210 size,）
Testing board
Thickness
: glass epoxy-resin substrate
: 0.8mm
Test Methods and
Remarks
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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11. Solderability
BK0402
BK0603
BK1005
BKH1005
BK1608
BK2125
BK2010
BK3216
ARRAY
At least 75％ of terminal electrode is covered by new solder.
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806
MCF 1210
MCF 2010
CK1608
CK2125
CKS2125
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
Specified Value
LK1608
At least 75％ of terminal electrode is covered by new solder.
LK2125
HK0402
HK0603
HK1005
HK1608
HK2125
HKQ0402
HKQ0603W
HKQ0603S
HKQ0603U
AQ105
Test Methods and Solder temperature
Remarks Duration
: 230±5℃
：4±1 sec.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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12. Resistance to Soldering
BK0402
BK0603
BK1005
BKH1005
BK1608
BK2125
Appearance：No significant abnormality
Impedance change：Within ±30％
BK2010
BK3216
ARRAY
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806
MCF 1210
MCF 2010
CK1608
Appearance：No significant abnormality
Impedance change：Within ±20％
No mechanical damage.
CK2125
Remaining terminal electrode：70％ min
CKS2125
CKP1608
CKP2012
Inductance change
R10～4R7： Within ±10％
CKP2016
Specified Value
6R8～100： Within ±15％
CKP2520
NM2012
NM2520
CKS2125 ： Within ±20％
CKP2012、CKP2016、CKP2520、NM2012、NM2520： Within ±30％
No mechanical damage.
LK1005
LK1608
Remaining terminal electrode：70％ min.
Inductance change： Within ±15％
No mechanical damage.
Remaining terminal electrode：70％ min.
Inductance change
LK2125
47N～4R7： Within ±10％
5R6～330： Within ±15％
HK0402
HK0603
HK1005
HK1608
HK2125
HKQ0402
HKQ0603W
No mechanical damage.
Remaining terminal electrode：70％ min.
Inductance change： Within ±5％
HKQ0603S
HKQ0603U
AQ105
Solder temperature
Duration
Test Methods and Preheating temperature
：260±5℃
：10±0.5 sec.
：150 to 180℃
：3 min.
Remarks
Preheating time
Flux
：Immersion into methanol solution with colophony for 3 to 5 sec.
Recovery
：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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13. Thermal Shock
BK0402
BK0603
BK1005
BKH1005
BK1608
BK2125
Appearance：No significant abnormality
Impedance change： Within ±30％
BK2010
BK3216
ARRAY
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806
Appearance：No significant abnormality
Impedance change： Within ±20％
MCF 1210
MCF 2010
CK1608
No mechanical damage.
CK2125
Inductance change：Within ±20％ Q change：Within ±30％
Inductance change：Within ±20％ （CKS2125）
CKS2125
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
Specified Value
No mechanical damage.
Inductance change： Within ±30％
No mechanical damage.
LK1608
Inductance change： Within ±10％ Q change： Within ±30％
LK2125
HK0402
HK0603
HK1005
HK1608
HK2125
No mechanical damage.
HKQ0402
HKQ0603W
HKQ0603S
HKQ0603U
AQ105
Inductance change： Within ±10％ Q change： Within ±20％
Conditions for 1 cycle
Step
temperature（℃）
time（min.）
1
2
3
4
Minimum operating temperature ＋0/－3
Room temperature
30±3
2～3
Test Methods and
Remarks
Maximum operating temperature ＋3/－0
Room temperature
30±3
2～3
Number of cycles：5
Recovery：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
(Note 1) When there are questions concerning measurement result；measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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14. Damp Heat（ Steady state）
BK0402
BK0603
BK1005
BKH1005
BK1608
BK2125
Appearance：No significant abnormality
Impedance change： Within ±30％
BK2010
BK3216
ARRAY
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806
MCF 1210
MCF 2010
CK1608
Appearance：No significant abnormality
Impedance change： Wihin ±20％
No mechanical damage.
Inductance change： Within ±20％ Q change： Within ±30％
Inductance change： Within ±20％
CK2125
CKS2125
CKP1608
Specified Value
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
No mechanical damage.
Inductance change： Within ±30％
No mechanical damage.
Inductance change： Within ±10％ Q change： Within ±30％
No mechanical damage.
LK1608
LK2125
Inductance change： Within ±20％ Q change： Within ±30％
HK0402
HK0603
HK1005
HK1608
HK2125
HKQ0402
HKQ0603W
No mechanical damage.
Inductance change： Within ±10％ Q change： Within ±20％
HKQ0603S
HKQ0603U
AQ105
BK、BKP、BKH Series、MCF Series：
Temperature ：40±2℃
Humidity
Duration
Recovery
：90 to 95％RH
：500＋24/－0 hrs
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
Test Methods and
Remarks
LK、CK、CKS、CKP、NM、HK、HKQ、AQSeries：
Temperature ：40±2℃（ LK、CK、CKS、CKP、NM Series）
：60±2℃（ HK、HKQ、AQ Series）
Humidity
Duration
Recovery
：90 to 95％RH
：500±12 hrs
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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15. Loading under Damp Heat
BK0402
BK0603
BK1005
BKH1005
BK1608
BK2125
BK2010
BK3216
ARRAY
Appearance：No significant abnormality
Impedance change： Within ±30％
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806
MCF 1210
MCF 2010
CK1608
No mechanical damage.
Inductance change： Within ±20％ Q change： Within ±30％
No mechanical damage.
CK2125
CKS2125
Inductance change： Within ±20％
CKP1608
CKP2012
Specified Value
CKP2016
No mechanical damage.
Inductance change： Within ±30％
CKP2520
NM2012
NM2520
No mechanical damage.
LK1005
LK1608
LK2125
Inductance change： Within ±10％ Q change： Within ±30％
No mechanical damage.
Inductance change： 0.047～12.0μH： Within ±10％ 15.0～33.0μH： Within ±15％
Q change： Within ±30％
No mechanical damage.
Inductance change： Within ±20％ Q change： Within ±30％
HK0402
HK0603
HK1005
HK1608
HK2125
HKQ0402
HKQ0603W
No mechanical damage.
Inductance change： Within ±10％ Q change： Within ±20％
HKQ0603S
HKQ0603U
AQ105
BK、BKP、BKH Series：
Temperature
Humidity
：40±2℃
：90 to 95％RH
：Rated current
：500＋24/－0 hrs
Applied current
Duration
Recovery
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
Test Methods and
Remarks
LK、CK、CKS、CKP、NK、HK、HKQ、AQ Series：
Temperature
：40±2℃（ LK、CK、CKS、CKP、NM Series）
：60±2℃（ HK、HKQ、AQ Series）
Humidity
：90 to 95％RH
Applied current
Duration
Recovery
：Rated current
：500±12 hrs
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air
pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-01
16. Loading at High Temperature
BK0402
BK0603
BK1005
BKH1005
BK1608
BK2125
Appearance：No significant abnormality。
Impedance change： Within ±30％
BK2010
BK3216
ARRAY
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806
MCF 1210
MCF 2010
CK1608
Appearance：No significant abnormality
Impedance change： Within ±20％
No mechanical damage.
Inductance change： Within ±20％ Q change： Within ±30％
No mechanical damage.
CK2125
CKS2125
CKP1608
Inductance change： Within ±20％
CKP2012
Specified Value
CKP2016
CKP2520
NM2012
NM2520
No mechanical damage.
Inductance change： Within ±30％
No mechanical damage.
LK1005
LK1608
LK2125
Inductance change： Within ±10％ Q change： Within ±30％
No mechanical damage.
Inductance change： 0.047～12.0μH： Within ±10％ 15.0～33.0μH： Within ±15％
Q change： Within ±30％
No mechanical damage.
Inductance change： Within ±20％ Q change： Within ±30％
HK0402
HK0603
HK1005
HK1608
HK2125
No mechanical damage.
HKQ0402
HKQ0603W
HKQ0603S
HKQ0603U
AQ105
Inductance change： Within ±10％ Q change： Within ±20％
BK、BKH、BKP Series、MCF Series：
Temperature : 125±3℃（BK、BKH Series）
: 85±3℃（BKP、MCF Series）
Applied current ：Rated current
Duration
：500＋24/－0 hrs
Recovery
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
（See Note 1）
Test Methods and
Remarks
LK、CK、CKS、CKP、NM、HK、HKQ、AQ Series：
Temperature : 85±2℃（LK、CK、CKS、CKP、NM Series）
: 85±2℃（HK1608，2125）
: 85±2℃（HK1005, AQ105 operating temperature range－55～＋85℃）
: 125±2℃（HK0402, HKQ0402, HK0603, HK1005, HKQ0603S, HKQ0603U, HKQ0603W, AQ105
operating temperature range－55～＋125℃）
Applied current ：Rated current
Duration
：500±12 hrs
Recovery
：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air
pressure. Unless otherwise specified, all the tests are conducted under the "standard condition."
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-01
Precautions on the use of Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
Multilayer common mode choke coils（MC series F type）
■PRECAUTIONS
1. Circuit Design
◆Verification of operating environment, electrical rating and performance
1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social
ramifications.
As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly
Precautions
differentiated from components used in general purpose applications.
◆Operating Current（Verification of Rated current）
1. The operating current for inductors must always be lower than their rated values.
2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect.
2. PCB Design
◆Pattern configurations（Design of Land-patterns）
1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder used（size of fillet）can directly affect inductor
performance.
Therefore, the following items must be carefully considered in the design of solder land patterns:
（1） The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or
cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder
pads which in turn determines the amount of solder necessary to form the fillets.
（2） When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's
Precautions
soldering point is separated by solder-resist.
（3） The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to
design land patterns smaller than terminal electrode of chips.
◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing
processes （PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered
boards etc.）For this reason, planning pattern configurations and the position of SMD inductors should be carefully performed to
minimize stress.
◆Pattern configurations（Design of Land-patterns）
1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts（larger fillets
which extend above the component end terminations）. Examples of improper pattern designs are also shown.
（1） Recommended land dimensions for a typical chip inductor land patterns for PCBs
Recommended land dimensions for wave-soldering （Unit：mm）
Type
1608
1.6
2125
2.0
3216
3.2
L
Size
W
0.8
1.25
1.6
A
B
C
0.8～10
0.5～0.8
0.6～0.8
1.0～1.4
0.8～1.5
0.9～1.2
1.8～2.5
0.8～1.7
1.2～1.6
Technical
considerations
Recommended land dimensions for reflow-soldering （Unit：mm）
Type
0402
0.4
0603
0.6
1005
1.0
105
1.0
0.6
1608
1.6
2012
2.0
L
Size
W
0.2
0.3
0.5
0.8
1.25
A
B
C
0.15～0.25 0.20～0.30
0.10～0.20 0.20～0.30
0.15～0.30 0.25～0.40
0.45～0.55 0.50～0.55
0.40～0.50 0.30～0.40
0.45～0.55 0.60～0.70
0.8～1.0
0.6～0.8
0.6～0.8
0.8～1.2
0.8～1.2
0.9～1.6
Type
2125
2.0
2016
2.0
2520
2.5
3216
3.2
L
Size
W
1.25
1.6
2.0
1.6
A
B
C
0.8～1.2
0.8～1.2
0.9～1.6
0.8～1.2
0.8～1.2
1.2～2.0
1.0～1.4
0.6～1.0
1.8～2.2
1.8～2.5
0.6～1.5
1.2～2.0
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-01
Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when
designing land-patterns.
Recommended land dimension for Reflow-soldering
Type
3216
3.2
2010
2.0
1210
1.25
1.0
0806
0.85
0.65
L
Size
W
1.6
1.0
a
b
c
d
0.7～0.9
0.8～1.0
0.4～0.5
0.8
0.5～0.6
0.5～0.6
0.2～0.3
0.5
0.45～0.55 0.25～0.35
0.7～0.8 0.25～0.35
0.25～0.35 0.25～0.35
0.55 0.5
（Unit：mm）
（（2） Examples of good and bad solder application
Item
Not recommended
Recommended
Mixed mounting of SMD and
leaded components
Component placement close to
the chassis
Hand-soldering of leaded
components near mounted
components
Horizontal component
placement
◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical
stresses from board warp or deflection.
Item
Nt recommended
Recommended
Position the
component at a right
angle to the direction
of the mechanical
stresses that are
anticipated.
Deflection of the board
1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary
depending on inductor layout.
An example below should be counted for better design.
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the
method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and
perforation. Thus, any ideal SMD inductor layout must also consider the PCB splitting procedure.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-01
3. Considerations for automatic placement
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards.
2. The maintenance and inspection of the mounter should be conducted periodically.
◆Selection of Adhesives
Precautions
1. Mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics
unless the following factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening
temperature and hardening period. Therefore, it is imperative to consult the manufacturer of the adhesives on proper usage and
amounts of adhesive to use.
◆Adjustment of mounting machine
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the
following points should be considered before lowering the pick-up nozzle:
（1） The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the
board.
（2） The pick-up pressure should be adjusted between 1 and 3N static loads.
（3） To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be
used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement:
Item
Improper method
Proper method
Single-sided mounting
Double-sided mounting
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical
impact on the inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance,
inspection and replacement of the pin should be conducted periodically.
Technical
◆Selection of Adhesives
considerations
1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of
the inductors may result in stresses on the inductors and lead to cracking. Moreover, too little or too much adhesive applied to the
board may adversely affect component placement, so the following precautions should be noted in the application of adhesives.
（1） Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly.
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
（2） When using adhesives to mount inductors on a PCB, inappropriate amounts of adhesive on the board may adversely affect
component placement. Too little adhesive may cause the inductors to fall off the board during the solder process. Too much
adhesive may cause defective soldering due excessive flow of adhesive on to the land or solder pad.
［Recommended conditions］
Amount of adhesives
After inductors are bonded
Figure
0805 case sizes as examples
a
b
c
0.3mm min
100～120μm
Area with no adhesive
4. Soldering
Precautions
◆Selection of Flux
1. Since flux may have a significant effect on the performance of inductors, it is necessary to verify the following conditions prior to use;
（1） Flux used should be with less than or equal to 0.1 wt% （Chlorine conversion method） of halogenated content. Flux having a strong
acidity content should not be applied.
（2） When soldering inductors on the board, the amount of flux applied should be controlled at the optimum level.
（3） When using water-soluble flux, special care should be taken to properly clean the boards.
◆Soldering
1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions, and please contact us
about peak temperature when you use lead-free paste.
Technical
◆Selection of Flux
considerations
1-1. When too much halogenated substance（Chlorine, etc.）content is used to activate the flux, or highly acidic flux is used, an excessive
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the
surface of the Inductor.
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may
detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of Inductor in high
humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The
cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux.
◆Soldering
1-1. Preheating when soldering
Heating: Chip inductor components should be preheated to within 100 to 130℃ of the soldering. Cooling: The temperature difference
between the components and cleaning process should not be greater than 100℃.
Chip inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the
soldering process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal
shock.
Recommended conditions for soldering
［Reflow soldering］
Temperature profile
※Ceramic chip components should be preheated to within 100 to 130℃ of the
soldering.
※Assured to be reflow soldering for 2 times.
Caution
1. The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the thickness of the inductor, as shown
below:
2. Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to
recommended times as possible.
［Wave soldering］
Temperature profile
※Ceramic chip components should be preheated to within 100 to 130℃ of the
soldering.
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
Caution
1. Make sure the inductors are preheated sufficiently.
2. The temperature difference between the inductor and melted solder should not be greater than 100 to 130℃.
3. Cooling after soldering should be as gradual as possible.
4. Wave soldering must not be applied to the inductors designated as for reflow soldering only.
［Hand soldering］
Temperature profile
（※⊿ＴT190℃（ 3216Type max）, ⊿Ｔ≦130℃（ 3225 Type ming）
※It is recommended to use 20W soldering iron and the tip is 1φ or less.
※The soldering iron should not directly touch the components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable soldering condition, therefore
these profiles are not always recommended.
Caution
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.
2. The soldering iron should not directly touch the inductor.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-01
5. Cleaning
Precautions
◆Cleaning conditions
1. When cleaning the PC board after the Inductors are all mounted, select the appropriate cleaning solution according to the type of flux
used and purpose of the cleaning（e.g. to remove soldering flux or other materials from the production process.）
2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the inductor's
characteristics.
◆Cleaning conditions
1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the inductor, resulting in a degradation
of the inductor's electrical properties（especially insulation resistance）.
2. Inappropriate cleaning conditions（insufficient or excessive cleaning）may detrimentally affect the performance of the inductors.
（1） Excessive cleaning
Technical
a. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the
cracking of the inductor or the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions
should be carefully checked;
considerations
Ultrasonic output
Below 20W/ℓ
Below 40kHz
5 min. or less
Ultrasonic frequency
Ultrasonic washing period
6. Post cleaning processes
◆Application of resin coatings, moldings, etc. to the PCB and components.
1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while
left under normal storage conditions resulting in the deterioration of the inductor's performance.
2. When a resin's hardening temperature is higher than the inductor's operating temperature, the stresses generated by the excess heat
may lead to inductor damage or destruction.
Precautions
3. Stress caused by a resin's temperature generated expansion and contraction may damage inductors.
The use of such resins, molding materials etc. is not recommended.
7. Handling
◆Breakaway PC boards（splitting along perforations）
1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deflection
or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆General handling precautions
1. Always wear static control bands to protect against ESD.
2. Keep the inductors away from all magnets and magnetic objects.
3. Use non-magnetic tweezers when handling inductors.
Precautions
4. Any devices used with the inductors（ soldering irons, measuring instruments） should be properly grounded.
5. Keep bare hands and metal products（i.e., metal desk）away from chip electrodes or conductive areas that lead to chip electrodes.
6. Keep inductors away from items that generate magnetic fields such as speakers or coils.
◆Mechanical considerations
1. Be careful not to subject the inductors to excessive mechanical shocks.
（1） If inductors are dropped on the floor or a hard surface they should not be used.
（2） When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other
boards or components.
8. Storage conditions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control
temperature and humidity in the storage area. Humidity should especially be kept as low as possible.
Recommended conditions
Precautions
Ambient temperature Below 40℃
Humidity Below 70% RH
The ambient temperature must be kept below 30℃. Even under ideal storage conditions inductor electrode solderability decreases as
time passes, so inductors should be used within 6 months from the time of delivery.
*The packaging material should be kept where no chlorine or sulfur exists in the air.
◆Storage
Technical
1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of
terminal electrodes and deterioration of taping/packaging materials may take place. For this reason, components should be used within
6 months from the time of delivery. If exceeding the above period, please check solderability before using the inductors.
considerations
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-01
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